tetrahedron having one bridging and three non-bridging oxygens: Si/O ratio = 1/3.5;
charge of the dimer: [Si2O7]6-, (for example, rankinite Ca3Si2O7);
3) single chain silicates, each tetrahedron having two bridging and two non-
bridging oxygens: Si/O ratio = 1/3; a chain with N links has a charge [SiO3]n
2n- (for
example, enstatite MgSiO3);
4) double chain silicates, half of the tetrahedra with two bridging and two non-
bridging oxygens (Si/O = 1/3) and other half three bridging and one non-bridging
(Si/O = 1/(2.5): in total Si/O = 2/5.5 and the charge is [Si4O11]n
6n- (for example,
anthophyllite Mg7Si8O22(OH)2, the OHs being independent of the tetrahedra);
5) silicates forming two dimensional layers, each tetrahedron with three
bridging and one non-bridging oxygens: Si/O = 1/(2.5); charge of a layer [Si2O5]n
2n-
(for example, minerals of clays and micas or talc: Mg6Si8O20 (OH)4, the OHs being
here again independent of the tetrahedra);
6) lastly, silicates where the tetrahedra are linked at all their corners: four
bridging oxygens per tetrahedron, Si/O = 1/2 (for example, quartz SiO2). Quartz is
part, like diamond, of a covalent description where the molecule extends to the scale
of the entire crystal, regularly in the three-dimensional space.
In addition to this classification, we can observe that:
– when Al substitutes Si in the tetrahedron, we must consider the (Al+Si)/O
ratio: for example, plagioclase feldspars, which range from albite NaAlSi3O8 to
anorthite CaAl2Si2O8, the (Al+Si)/O ratio always being 1/2;
– Al is generally in a tetrahedral site, instead of Si, but can be in an octahedral
site: for example, muscovite mica K2Al4
octa[Si6Al2O20](OH)4, where tetrahedral
coordination group is the one located between brackets [ ];
– an important point for the structure of hydrous silicates is the fact that O2- and
OH- have the same ionic radius: 1.40 Å.
We must not be misled by the examples of MgO, BaTiO3 or diamond: most
ceramics do not crystallize in a cubic group and this implies that the many physical
properties that are described by a second order tensor are not isotropic [NYE 87].
Thermal expansion, optical index, electric and thermal conductivities, permittivity
and permeability are at first view anisotropic, which can misinform some
metallurgists, because the most common metals (iron, aluminum, copper) are cubic.
An effect of the anisotropy of thermal expansion is to create residual stress at the
grain boundaries of the polycrystals. Beyond the properties described by a second
order tensor, low symmetries combine with the properties of iono-covalent bonds to
make dislocations rare and relatively immobile, which explains the lack of ductility
and the impossibility of plastic deformation.
Ceramic Compounds: Ceramic Materials 23
1.5.2. Polymorphism: crystals and glasses
Many compounds of ceramic interest can exist in various varieties. We can
mention the polymorphism of zirconia ZrO2 – cubic at high temperatures, then
quadratic (tetragonal) and finally monoclinic at decreasing temperatures – a
polymorphism that was regarded for a long time as a disadvantage, then understood
as an advantage when the possibilities that it offered for the development of high
mechanical performance ceramics were discovered [HEU 81] (see Chapter 6).
However, it is the polymorphism of silica SiO2 that is most frequently used in
ceramic and glass industry.
Sand is primarily made up of silica, often highly pure (more than 98%), SiO2
having been crystallized in the form of quartz α, also known as low quartz (point
group 32, without center of symmetry). When heated to 573°C, quartz α transforms
to quartz β (high quartz, point group 622, centrosymmetric). Higher treatment
temperatures help distinguish two types of behavior, depending on whether
thermodynamically stable phases are achieved or whether kinetic effects favor
metastable phases. These effects depend on the relative ease with which the
transformations occur: displacive transformations – which require only small atomic
movements to change the structure of a phase and modify its symmetries – are easier
than reconstructive transformations – which require the structure to be destroyed and
then recomposed. Figure 1.2 schematizes the evolutions between the various
possible phases: the transformations indicated by vertical arrows are fast and always
happen; those indicated by horizontal arrows are slow and often require, in order to
occur, the addition of impurities that play the role of mineralizers. Thus, the
transformation of quartz into tridymite is generally not achieved in the temperature
range in which it is predicted by the equilibrium diagram, because what is formed is
cristobalite, which is metastable.
High cristobalite melts at 1,723°C to produce an extremely viscous liquid
(4 MPa.s). On cooling, this high viscosity generally prohibits crystallization, from
which it maintains a super-molten liquid and then, below the glass transition
temperature [ZAR 82], a silica glass (molten silica, often called, incorrectly, molten
quartz or, even worse, quartz). Heated at a sufficiently high temperature to allow
sufficient atomic mobility (for example, about 1,100°C), silica glass tends to
devitrify to produce cristobalite. The crystallized varieties of silica have properties
that are very different from silica glass: the former exhibits anisotropic
characteristics in general, whereas glass is isotropic and they have remarkable
expansion coefficients (in the order of 10-5K-1), whereas silica glass has
exceptionally poor thermal expansion (about 0.5.10-6K-1).
24 Ceramic Materials
High quartz
Low quartz
High tridymite
Middle tridymite
Low tridymite
High cristobalite
Low cristobalite
,
Figure 1.2. Main crystallized varieties of silica
Figure 1.3 illustrates the difference between crystallized quartz, where the
tetrahedra [SiO4]4- are linked at their four corners to form an architecture regular in
its angles and its ranges (crystal = triperiodicity, i.e. long-range order), and silica
glass, where a short-range order continues to exist, significantly similar to the one
that exists in the crystal, but with dangling bonds and distortions in angles and
variations in length that disorganize the structure.
Figure 1.3. Illustration of the structure of quartz (on the right) and silica glass (on the left);
this two-dimensional diagram must be imagined in three dimensions, the silicon atom
(full circle) being at the center of a tetrahedron of four oxygen atoms (hollow circle),
of which only three are represented here
Ceramic Compounds: Ceramic Materials 25
1.5.3. Ceramic microstructures
The microstructural aspects are discussed in detail in Chapter 3, but we must
underline the decisive role that the ceramic microstructure plays in relation to their
properties, particularly sensitive properties like mechanical resistance or electric
conductivity. The performances of the other categories of materials also depend on
their microstructure, but seldom to the same extent as in the case of ceramics. There
are several reasons for this sensitivity of ceramics to microstructural parameters:
– the material is processed whilst the object is manufactured, therefore the causes
for any disparity in the material are multiplied by the disparity of the processes;
– sintering is accompanied by considerable dilatometric effects, with strong
variations in porosity: pores and defects due to differential expansions are inherent
to ceramic microstructures; they are rarer in metals prepared by plastic deformation
or machining;
– the granular properties of ceramics are more often anisotropic than in the case
of other categories of materials;
– ceramics have poor toughness, with critical stress intensity factors (Kc)
generally lower than 5 MPa.m1/2, i.e. an order of magnitude lower than that of most
metals. However, as mechanical resistance to brittle fracture (σf) is proportional to
Kc and inversely proportional to the square root of the equivalent size of the critical
defect (ac), the defects must be, for a given value of σf, 100 times smaller in
ceramics than they can be in metals. This is all the more difficult to control since the
size of the grains of ceramics is often lower than that of metals: it is much more
difficult to avoid 50 μm defects in a ceramic whose grains are 5 μm than notches of
a centimeter in a metal whose grains are 100 μm. The absence of plasticity does not
allow the relaxation of excessive stresses;
– the iono-covalent bond is less receptive to impurities than the metallic bond,
and therefore segregations are more frequent in ceramics than in metals; given that
electric conductivity can vary by more than 20 orders of magnitude between a
conductor and an insulator, we understand that the presence of a insulating film at
the grain boundaries of a material expected to be a conductor, or that of a conducting
phase interlinked in a matrix expected to be insulating, can destroy the expected
functionalities;
– the frequency of the polymorphism of ceramic phases and the ability of a
number of silicate phases to be crystallized or vitreous introduce additional variables
into the complexity of ceramic microstructures.
Despite the small number of really useful ceramic compounds, the variety of
microstructures makes a very large number of different applications possible. We
will limit ourselves to two examples: a ceramic prosthesis in alumina must be dense
and fine-grained – to optimize mechanical resistance and tribological properties –
26 Ceramic Materials
whereas an alumina refractory material must be porous and coarse-grained – to
optimize resistance to thermal shocks and creep strength. Controlling the properties
of ceramics requires controlling their microstructures.
1.6. Specificity of ceramics
The variety of ceramics is such that they do not exhibit uniform characteristics,
but there are common features that give them an undeniable specificity. Most of
these common features have already been mentioned, but it is useful to recapitulate
the overall physiognomy:
– the iono-covalent bonds confer properties of electric insulation and
transparency in the visible range, even if some semiconducting compounds and
those that have a partially metallic nature are an exception to this rule;
– the thermal conductivity of ceramics is often poor, because electrons do not, or
hardly take part in it, but conduction by network vibrations (phonons) can be
considerable: it is diamond, a non-metal, that is the best thermal conductor at
ambient temperature and certain ceramics (AlN, BeO, SiC) perform better than
copper in this respect;
– strong and directed, subject to electrostatic restrictions, the iono-covalent
bonds of ceramics do not allow the movement of the dislocations, i.e. linear defects
in atomic stacking that are the reason for the plasticity of metals; hence their
brittleness. On the other hand, ceramics offer a high degree of hardness and high
moduli of elasticity; their mechanical resistance can be remarkable; they are light;
their melting point is generally high;
– most ceramics exhibit good resistance to chemical aggressions. As regards
oxidation, we must distinguish oxides (stable in an oxidizing atmosphere, which
helps us to take advantage of their refractoriness) from non-oxides, which can
oxidize at relatively low temperatures and whose use at high temperatures requires
protective, neutral or reducing atmospheres. Graphites and carbons are thus
ultrarefractory (sublimation beyond 3,500°C), but they can be used only in
protective gas. Among non-oxides, silicon compounds (silicon carbide SiC, silicon
nitride Si3N4, molybdenum disilicide MoSi2) exhibit the remarkable ability of self-
protection from oxidation thanks to a tight and overlapping silica layer SiO2 (until
about 1,800°C for MoSi2). It is erroneous to identify refractoriness with a high
melting point because a high melting point is a necessary but insufficient condition:
chemical compatibility with the environment and sufficient thermomechanical
performances (sufficiently low creep rate, in particular) are also necessary.
Ceramic Compounds: Ceramic Materials 27
1.7. Bibliography
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[BED 86] BEDNORZ J.G. and MÜLLER K.A., “Possible high-Tc superconductivity in the
Ba-La-Cu-o systems”, Z. Phys., UB 64, p. 189-193, 1986.
[BRO 91] BROOK R.J. (ed.), Concise Encyclopedia of Advanced Ceramic Materials,
Pergamon Press, 1991.
[BUR 90] BURNS G. and GLAZER A.M., Space Groups for Solid State Scientists, Academic
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[CAS 90] CASTEL A., Les alumines et leurs applications, Nathan, 1990.
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[COL 99] COLLECTIVE WORK, Ceramics Monographs, Handbook of Ceramics, updated
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[EMS 95] EMSLEY J., The Elements, Clarendon Press, 1995.
[GER 96] GERMAN R.M., Sintering Theory and Practice, John Wiley, 1996.
[GIA 85] GIACOVAZZO C. (ed.), Fundamentals of Crystallography, Oxford Science
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[HAH 89] HAHN T. (ed.), International Tables for Crystallography, Vol. A, Kluwer
Academic Publ., 1989.
[HEU 81] HEUER A.H. and HOBBS L.W. (eds), Advances in Ceramics, vol. 3, American
Ceramic Society, 1981.
[JAF 88] JAFFE H.W., Introduction to Crystal Chemistry, Cambridge University Press, 1988.
[KIN 76] KINGERY W.D., BOWEN H.K. and UHLMANN D.R., Introduction to Ceramics,
2nd ed., John Wiley & Sons, 1976.
[KIN 84] KINGERY W.D. (ed.), Structure and Properties of MgO and Al2O3 Ceramics,
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[LEG 92] LEGENDRE A., Le matériau carbone, Eyrolles, 1992.
[MCC 83] MCCOLM I.J., Ceramic Science for Materials Technologists, Leonard Hill, 1983.
[NYE 87] NYE J.F., Physical Properties of Crystals, Oxford Science Publications, 1987.
[OBA 84] O’BANNON L.S., Dictionary of Ceramic Science and Engineering, Plenum Press,
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[PUT 92] PUTNIS A., Introduction to Mineral Sciences, Cambridge University Press, 1992.
[RIN 96] RING T., Fundamentals of Ceramic Powder Processing and Synthesis, Academic
Press, 1996.
28 Ceramic Materials
[TAY 97] TAYLOR H.F.W., Cement Chemistry, Academic Press, 1997.
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[WES 90] WEST A.R., Solid State Chemistry and its Applications, John Wiley, 1990.
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